SK hynix has stood out at the Open Compute Project (OCP) Global Summit 2024, held from October 15 to 17 in San Jose, California, where it presented its latest memory solutions designed for artificial intelligence (AI) and data centers. This annual event brings together industry leaders to discuss advances in open hardware and data center technologies, under the theme “From Ideas to Impact.”
During the event, SK hynix reinforced its position as a leader in the sector by showcasing technological innovations that will transform the future of intensive computing and data management, highlighting its commitment to high-performance memory and collaboration with key industry players.
Cutting-edge products for AI and data centers
Among the products presented by SK hynix, standout products include the CMM-Ax3 (Compute Memory Module), an optimized solution for compute-intensive workloads and AI infrastructure applications, as well as its Niagara 2.0, an integrated hardware and software system for efficient management of pooled memory, allowing multiple hosts to share large memory resources. These products are designed to address the challenges faced by data centers in terms of speed, efficiency, and scalability.
Innovation in memory for AI
One of the most innovative products that SK hynix presented is its HBM3E memory alongside the NVIDIA H200 Tensor Core GPU and the Superchip NVIDIA GB200 Grace Blackwell, which represent a breakthrough in high-speed data processing. DDR5 products such as RDIMM and MCR DIMM were also showcased, designed to meet the growing computational and energy demands of AI-driven data centers.
In the SSD section, SK hynix presented eSSD Gen5 PS1010 and PS1030 solutions, as well as the Gen4 PE9010, which provide ultra-fast read/write speeds essential for accelerating AI training and inference in large-scale environments.
Expanded sessions: sharing experience in memory for AI
This year, SK hynix increased its participation in the OCP Global Summit, with eight presentations focused on the future of memory solutions for AI, compared to the five sessions from the previous year. Key speakers such as Youngpyo Joo, Software Solutions Head, and Euicheol Lim, Advanced Solutions Technology Head, discussed how computational memory and CXL innovations are reshaping system architecture for AI workloads.
With these sessions, SK hynix reaffirms its role as a leading provider of memory solutions for artificial intelligence, sharing its vision and innovative solutions that will redefine the technological infrastructure of data centers in the coming years.
Leading the next generation of technologies
With its presence at the OCP Global Summit 2024, SK hynix demonstrates its commitment to advancing memory solutions for AI and data centers. The company continues to drive research and development of technologies that not only optimize performance and efficiency but also open up new possibilities in the field of artificial intelligence, solidifying its position at the forefront of technological innovation.