Here’s the translation into American English:
At the 26th edition of the Korea Semiconductor Exhibition (SEDEX), held at COEX in Seoul, SK hynix showcased its latest memory technology and vision for the era of artificial intelligence (AI). Under the slogan “Memory, the Heart of AI,” the company presented innovative memory solutions, emphasizing its leadership in the AI sector with products such as HBM3E, PIM, and CXL, designed to optimize performance in AI and big data applications.
A Comprehensive Approach to AI and Advanced Packaging Technology
The event, organized by the Korea Semiconductor Industry Association, featured participation from 250 companies and more than 600 booths showcasing a wide variety of semiconductor devices, equipment, and solutions. SK hynix’s exhibition focused on its range of high-performance products for AI, such as the 12-layer HBM3E, a high bandwidthBandwidth is the maximum capacity for data transfer… memory specifically developed for AI workloads that the company began mass production of in September 2024.
One of the highlights of the SK hynix booth was an LED mural depicting a virtual data centerA data center or data processing center (DPC) … powered by HBM3E GPUs, offering attendees an immersive experience of how an AI data center operates.
Memory Innovations for AI: HBM, PIM, and CXL
HBM (High Bandwidth Memory) was one of the main attractions, featuring an artistic installation that compared the capabilities of this 12-layer product with the world’s first DRAM from 1970 using grains of rice, illustrating the technological leap in data storage. To its left, a special area showcased advanced technologies such as PIM (Processing-In-Memory) and CXL (Compute Express Link).
In the PIM area, SK hynix displayed products like AiM and AiMX, which combine GDDR6-AiM chips, providing a high-speed, low-power memory solution optimized for generative AI applications. The CXL section included modules like the CMM-DDR5, which increases system bandwidth by up to 50% and capacity by 100% compared to systems with only DDR5, and the CMM-Ax, which integrates machine learning and data filtering functions, ideal for data centers and AI workloads.
Solutions for AI Servers and Devices
To the right of the HBM area, the company presented solutions for AI servers and devices. Notably, the 1cnm DDR5 RDIMM improves energy efficiency by 9% and offers an 11% faster operating speed. These modules, designed for the high-performance computing market, promise to reduce operational costs for data centers by up to 30%.
Regarding AI solutions for devices, the showcase included the LPCAMM2, a package that combines LPDDR5X in a single compact module, providing space savings and lower energy consumption for AI applications in mobile devices. Also highlighted was the ZUFS 4.0, a mobile NAND solution that improves application startup speeds on smartphones by up to 45%, optimizing AI performance in the device.
Social Commitment and Interactive Activities
In addition to its technological innovations, SK hynix promoted its social value (SV) initiative with the Happy Bread bakery, a social enterprise that employs individuals with disabilities in the production of bread and cookies. This initiative from its subsidiary Happy Moa aims to create inclusive job opportunities.
To engage attendees, SK hynix organized various interactive activities, such as the “Find the Beetle X31” game in the branded SSDA solid-state drive, or SSD (acronym for solid-state … area, a fun experience to highlight the capabilities of its consumer products; along with various jump and pinball games in a dedicated play area showcasing its memory innovations. Additionally, visitors participated in activities such as a trivia contest and a raffle with prizes.
With its presence at SEDEX 2024, SK hynix reaffirms its role as a comprehensive memory provider for AI, presenting a forward-looking vision that combines cutting-edge technology with social responsibility.