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French company Scintil Photonics unveiled its revolutionary solution LEAF Light™ at the OFC 2025 trade show, the world’s first multi-channel laser integrated on a single chip. This innovation promises to be a game-changer in the development of co-packaged optical interconnections for artificial intelligence (AI) data centers, enabling higher bandwidth, lower power consumption, and ultra-low latencies.
The presentation is taking place at booth 6357 in the Moscone Center in San Francisco, where the company demonstrated how LEAF Light can deliver up to 2 Tbps per fiber using DWDM (Dense Wavelength Division Multiplexing) technology, which represents a key evolution over the already limited CWDM.
One chip, multiple wavelengths, and energy efficiency
LEAF Light is designed to address one of the major challenges of large-scale AI: massive data transmission between GPUs, TPUs, and accelerators in cloud environments. Compared to copper cables —which are already insufficient for these workloads— Scintil’s optical system enables the scalability necessary for future hyperscale data centers.
Key features include:
- Up to 16 multiplexed laser channels on a single chip with spacing of 100 or 200 GHz.
- Manufactured using the patented SHIP™ (Scintil Heterogeneous Integrated Photonics) process, which integrates III-V materials on standard silicon.
- Compatible with wafer-scale fabrication, allowing for mass production of tens of millions of units per year.
- Integrates control electronics and optical packaging necessary for use in ELSFP modules (External Laser Small Form-Factor Pluggable).
A solution ready for the AI explosion
“The market for AI accelerators is expected to reach $600 billion by 2030, with around 35 million units deployed,” stated Matt Crowley, CEO of Scintil Photonics. “LEAF Light is aligned with this trend and is the only chip capable of meeting all the requirements of the new co-packaged DWDM paradigm.”
Moreover, Sylvie Menezo, the company’s founder and CTO, emphasized that “the advancement of the multi-channel laser on a single chip not only addresses the need for greater density and speed but also reduces costs and improves energy efficiency in modern AI systems.”
Towards faster, more sustainable, and scalable data centers
The use of co-packaged DWDM will enable data centers to reduce latency, improve energy efficiency, and free up space by replacing electrical links with optical ones. LEAF Light is expected to become a fundamental component for future optical switches and highly scalable XPU architectures (GPU, CPU, TPU).
In addition to its exhibition at the trade show, Menezo will participate in technical conferences on light sources for AI and advanced packaging, where the impact of this technology on the future of optical networks will be discussed.
🧠 Key points of Scintil Photonics’ LEAF Light™:
- First multi-channel laser source on a single chip.
- Up to 2 Tbps per optical fiber.
- Design compatible with co-packaged optics for AI.
- Aligned with the massive demand for AI accelerators by 2030.
Source: Scintil Photonics