The South Korean company will replace silicon with glass in its semiconductor packaging, aiming for higher performance, lower costs, and leadership in the AI boom.
Samsung Electronics has outlined an ambitious roadmap that will transform its strategy in the semiconductor sector: starting in 2028, the company will begin using glass interposers in the manufacturing of advanced chips, focusing on improving the efficiency and scalability of processors designed for
This transition marks a technological milestone in the semiconductor packaging industry. Until now, silicon interposers have been the predominant solution in 2.5D structures, essential in AI chips where the GPU connects with HBM (High Bandwidth Memory) modules. Although effective in terms of performance and data transmission, silicon interposers have significant limitations in cost and production complexity.
The alternative proposed by Samsung—using glass as the base material—promises significant improvements: it allows for the manufacturing of thinner circuits, greater dimensional stability, and a substantial reduction in production costs. These advantages position the glass interposer as a key component for the next generation of processors dedicated to artificial intelligence.
A Bet on Speed and Efficiency
Samsung has opted for an accelerated implementation strategy. Unlike other manufacturers working with large glass panels, the company plans to work with smaller units (less than 100×100 mm). This decision could shorten prototyping development cycles and enhance agility compared to its competitors, although it could have implications for large-scale productivity.
To support this transition, Samsung will rely on its production center in Cheonan, which already has Panel-Level Packaging (PLP) lines—this type of packaging replaces traditional round wafers with square panels, ideal for working with glass substrates and improving process performance.
More Than Just an Innovation, an Integrated Strategy
The adoption of the glass interposer is part of a broader movement at Samsung to consolidate its leadership in the AI ecosystem, integrating its chip manufacturing services (foundry), HBM memory, and packaging solutions into a single service platform. This “integrated solution for AI” will allow the company to offer more competitive products tailored to the growing demands for performance, energy efficiency, and flexibility in data centers.
The shift also addresses the need to respond to the rising global demand for AI chips, where the ability to integrate more components in a compact space while maintaining communication speed among them is critical.
The Context: An Industry in Transformation
Samsung’s decision is part of a global trend toward the gradual replacement of traditional materials in semiconductor packaging. Various industry players are exploring glass-based solutions, although Samsung is one of the first to set a specific date for industrial adoption.
Industry analysts agree that glass as an interposer could become the new industry standard in the second half of this decade. In addition to its potential for reducing costs, it stands out for being suitable for increasingly dense chips with higher thermal and speed requirements, such as those demanded by generative artificial intelligence.
Heading Toward 2028: A New Frontier in Chip Design
The steps Samsung is preparing for 2028 are not just a technological evolution; they represent a strategic move to redefine its competitive position in the age of artificial intelligence. The ability to integrate advanced packaging with proprietary memory and production technologies gives the South Korean company a key advantage over rivals like Intel, AMD, or TSMC.
With this paradigm shift, Samsung aims to lead a new generation of infrastructure for AI, capable of addressing the challenges of performance, scalability, and energy efficiency that will define the next decade.
Glass, silent and transparent, might become the most solid component of the future of computing. And Samsung wants to be at the center of that transformation.
Source: etnews