The semiconductor expert concludes his two-year contract with the South Korean company, marking a challenge in its bid to compete with TSMC and SK Hynix.
Samsung Electronics has confirmed the departure of Lin Jun-Cheng, corporate vice president responsible for advanced packaging technologies. Lin, who joined Samsung in March 2023 after a distinguished career of nearly two decades at TSMC, left the company following the completion of his two-year contract.
A key leader in packaging technologies
During his time at Samsung, Lin played a crucial role in advancing advanced packaging technologies, essential for the next generation of high-performance chips. His achievements include developments in:
- HBM-16H: High bandwidth memory technologies.
- I-CubeE and I-CubeR: Integrated solutions for 3D packaging.
- CPO (Chiplet Package Optimization): Packaging optimization for modular chips.
In a post on LinkedIn, Lin expressed his gratitude to Samsung and his colleagues, stating:
“I am satisfied to have contributed to the advancement of both the company and my professional career through the application of these advanced technologies. These two years have been a pleasant and meaningful journey.”
A challenge for Samsung in a competitive market
Lin’s departure comes at a critical time for Samsung, which is seeking to solidify its position against TSMC and SK Hynix in the semiconductor and packaging market. Although Samsung has reported significant profits in 2024, it still faces challenges in key areas such as HBM4HBM4 is the next evolution in memory technology… memory, where SK Hynix has been a leader.
Additionally, Samsung’s internal restructuring, which began in November 2024, has raised questions about its ability to innovate. While the change in its executive team was expected to bring new ideas, recent decisions have been criticized for relying too heavily on company veterans, potentially limiting the necessary reforms.
A legacy in the industry
Before joining Samsung, Lin was a key figure at TSMC, where he contributed to the development of their 3D packaging technology and managed over 450 patent applications in the United States. His experience includes roles at companies such as Micron Technology and Skytech, solidifying him as one of the most influential experts in the field of advanced packaging.
His exit from Samsung raises questions about his next steps and whether he will return to the semiconductor industry in Taiwan, where he is recognized for his impact on the development of innovative technologies.
A transforming market
The advancement of packaging technologies is crucial for the next generation of semiconductors, especially in artificial intelligence applications, which require chips with greater density and energy efficiency. Lin’s departure represents a challenge for Samsung, which has intensified its investments in this sector since 2022 to strengthen its advanced packaging team.
With SK Hynix and TSMC leading in innovation, Samsung will need to demonstrate its ability to maintain competitiveness in a highly dynamic market while seeking to capitalize on the growing demand for high-tech solutions. Lin’s departure, while significant, underscores the need to continue attracting top-tier talent to drive innovation in a strategic sector for the future of technology.
via: LinkedIn