The MMC connector triples the density of traditional MPOs with one-third of their size and promises to revolutionize optical connectivity in high-density environments.
Panduit, a globally recognized leader in innovative electrical and networking infrastructure solutions, has officially been certified by US Conec to offer MMC products, including the revolutionary Multi-fiber Multi-Connector (MMC). With this certification, Panduit consolidates its commitment to leading the next generation of ultra-high-density connectivity, specially designed to meet the demands of networks at 800G and beyond.
Based on US Conec’s DirectConec™ push-pull technology, the MMC connector marks a significant leap forward compared to conventional MPO connectors. This new format, classified as Very Small Form Factor (VSFF), provides three times the fiber density while occupying only a third of the size. This optimization enables the deployment of more compact, efficient, and scalable optical infrastructure—particularly relevant as data centers grow into hyper-scale facilities and Artificial Intelligence implementations accelerate.
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During the summer, Panduit will also introduce new MMC-16 assemblies, which combine MMC-16 and MPO-8 connectors, along with high-density panels designed to maximize space efficiency in racks and communication cabinets.
This launch complements Panduit’s existing high-density cabling management portfolio, which already includes the Base-16 Fiber cabling system and Base-8 MPO interconnections, developed to maintain flexibility and modularity in critical environments.
Additionally, the company continues to promote RapidID™, its automated network mapping system, which simplifies cable documentation, reduces human errors, and significantly shortens the time needed for cable identification and management during maintenance operations.
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David Newman, the head of Panduit’s data center connectivity product line, explained:
“Incorporating the MMC product line demonstrates our commitment to innovation and helping our customers improve their operational efficiency. Our combination of MMC connectors with RapidID addresses the optical density challenges faced by data centers handling Artificial Intelligence workloads and hyper-scale infrastructures.”
According to Panduit, the increasing demand for higher transmission speeds and density from companies deploying generative AI models, edge computing environments, or multicloud platforms is forcing a redesign of interconnection architectures. The adoption of MMC connectors is seen as a direct response to this trend, providing scalability, energy efficiency, and simplified management.