CloudDiamond blankets for chips: this is how the industry wants to cool the next generation of processors and GPUsOct 22, 20259 read timeCloudSOCAMM2: the new “compact and efficient” LPDDR5X module JEDEC is preparing for AI serversOct 22, 20258 read timeCloudChina launches UBIOS: a new firmware standard that reimagines the “BIOS” with unified virtual bus and native heterogeneity supportOct 22, 20259 read timeLast newsAll the latest news from the technology and cloud sector.CloudSalesforce Builds the Foundations of “Trusted AI”: Unified Data, Common Semantics, and Open Governance for the Agentic Enterprise EraOct 3, 20251 read timeCloudSiPearl Presents Athena1, the “Sovereign” Processor for Dual-Use Purposes That Europe Wants to Defend Its Technological IndependenceOct 3, 20251 read timeCloudThe CEO of Phison warns: NAND shortage may last a decade — memory ‘supercycle’ in sight and ‘severe’ tensions in 2026Oct 3, 20258 read timeCloudOpenAI “blocks” nearly half of the world’s DRAM for its Stargate project: an agreement with Samsung and SK Hynix shakes up the entire supply chainOct 3, 20258 read timeCloudJensen Huang ignites debate: “China is only nanoseconds behind the US in chips” and calls for competing in its market to strengthen American influenceOct 3, 20258 read timeCloudWestern Digital Defends the Role of HDDs in the AI Era: 80% of Hyperscale Storage Still on Disks, and 44TB Drives with HAMR Coming in 2027Oct 2, 20259 read time Previous1…495051…964Next formulario cloud lateralCan we help you?Committed to helping you choose the best cloud infrastructure, software, backup/DR and technology solutions in general. Write to us and we will contact you.NameEmailCompanyTell us what you needI give my consent for this website to store my submitted information so that they can respond to my inquiry and share it with related third parties. Privacy policy.Send Message cloud news - home 11
CloudDiamond blankets for chips: this is how the industry wants to cool the next generation of processors and GPUsOct 22, 20259 read time
CloudSOCAMM2: the new “compact and efficient” LPDDR5X module JEDEC is preparing for AI serversOct 22, 20258 read time
CloudChina launches UBIOS: a new firmware standard that reimagines the “BIOS” with unified virtual bus and native heterogeneity supportOct 22, 20259 read time
CloudSalesforce Builds the Foundations of “Trusted AI”: Unified Data, Common Semantics, and Open Governance for the Agentic Enterprise EraOct 3, 20251 read time
CloudSiPearl Presents Athena1, the “Sovereign” Processor for Dual-Use Purposes That Europe Wants to Defend Its Technological IndependenceOct 3, 20251 read time
CloudThe CEO of Phison warns: NAND shortage may last a decade — memory ‘supercycle’ in sight and ‘severe’ tensions in 2026Oct 3, 20258 read time
CloudOpenAI “blocks” nearly half of the world’s DRAM for its Stargate project: an agreement with Samsung and SK Hynix shakes up the entire supply chainOct 3, 20258 read time
CloudJensen Huang ignites debate: “China is only nanoseconds behind the US in chips” and calls for competing in its market to strengthen American influenceOct 3, 20258 read time
CloudWestern Digital Defends the Role of HDDs in the AI Era: 80% of Hyperscale Storage Still on Disks, and 44TB Drives with HAMR Coming in 2027Oct 2, 20259 read time
