CloudNVIDIA Wants the AI Agents’ “Memory” to Live Outside the GPU: Here’s Its New Storage Platform with BlueField-4 Jan 6, 2026 4 read timeCloudSK hynix showcases its next-generation memory for the AI era at CES 2026: 48GB HBM4, SOCAMM2, LPDDR6, and 321-layer NAND Jan 6, 2026 7 read timeCloudNVIDIA Rubin: Six Chips, a “Supercomputer,” and the Race to Lower Token Costs in the Reasoning AI Era Jan 6, 2026 9 read timeLast newsAll the latest news from the technology and cloud sector.CloudSouth Korea Looks Toward the “Ångström Era”: A Roadmap Envisions 0.2 nm Logical Chips and Monolithic 3D by 2040 Dec 25, 2025 7 read timeCloudSouth Korea Sues 10 Former Samsung Employees Over Alleged Leak of 10-Nanometer DRAM Process to China Dec 25, 2025 6 read timeCloudTelefónica activates VoNR across all of Spain: what’s really changing with 5G SA voice for users and businesses Dec 25, 2025 5 read timeCloudIntel Demonstrates Its “Multichip Future”: Chiplets, HBM, and 3D Packaging to Scale Beyond the Grid Limit Dec 24, 2025 6 read timeCloudPalo Alto Networks and Google Cloud Expand Their Partnership to Secure the Wave of Generative AI (In an Agreement Worth Around $10 Billion) Dec 24, 2025 4 read timeCloudThe global semiconductor market breaks the $200 billion quarterly barrier and targets over $800 billion in 2025 Dec 24, 2025 5 read time Previous1…252627…1057Next formulario cloud lateral Newsletter Can we help you?Committed to helping you choose the best cloud infrastructure, software, backup/DR and technology solutions in general. Write to us and we will contact you.NameEmailCompanyTell us what you needI give my consent for this website to store my submitted information so that they can respond to my inquiry and share it with related third parties. Privacy policy.Send Message cloud news - home 11
CloudNVIDIA Wants the AI Agents’ “Memory” to Live Outside the GPU: Here’s Its New Storage Platform with BlueField-4 Jan 6, 2026 4 read time
CloudSK hynix showcases its next-generation memory for the AI era at CES 2026: 48GB HBM4, SOCAMM2, LPDDR6, and 321-layer NAND Jan 6, 2026 7 read time
CloudNVIDIA Rubin: Six Chips, a “Supercomputer,” and the Race to Lower Token Costs in the Reasoning AI Era Jan 6, 2026 9 read time
CloudSouth Korea Looks Toward the “Ångström Era”: A Roadmap Envisions 0.2 nm Logical Chips and Monolithic 3D by 2040 Dec 25, 2025 7 read time
CloudSouth Korea Sues 10 Former Samsung Employees Over Alleged Leak of 10-Nanometer DRAM Process to China Dec 25, 2025 6 read time
CloudTelefónica activates VoNR across all of Spain: what’s really changing with 5G SA voice for users and businesses Dec 25, 2025 5 read time
CloudIntel Demonstrates Its “Multichip Future”: Chiplets, HBM, and 3D Packaging to Scale Beyond the Grid Limit Dec 24, 2025 6 read time
CloudPalo Alto Networks and Google Cloud Expand Their Partnership to Secure the Wave of Generative AI (In an Agreement Worth Around $10 Billion) Dec 24, 2025 4 read time
CloudThe global semiconductor market breaks the $200 billion quarterly barrier and targets over $800 billion in 2025 Dec 24, 2025 5 read time
