NXP Semiconductors, a global leader in secure connectivity solutions for embedded applications, has announced an expanded collaboration with Amazon Web Services (AWS) to move the majority of its Electronic Design Automation (EDA) automation to the cloud. This decision marks a significant milestone in the semiconductor industry and promises to accelerate innovation in several key sectors.
Expansion of a fruitful collaboration
The collaboration between NXP and AWS is not new. It is based on a three-year relationship that is now being significantly expanded. NXP will leverage the performance, scalability, and security of AWS to deliver semiconductor design implementations in critical areas such as automotive, Internet of Things (IoT), mobile solutions, and communications.
Cloud Center of Excellence
To facilitate this transition, NXP has established a Cloud Center of Excellence (CCoE). This center is responsible for ensuring the governance of cloud workloads, training employees, and standardizing application development. This initiative demonstrates NXP’s commitment to adopting cutting-edge technologies to enhance its design and production processes.
Recent Achievements and Benefits
Recently, NXP successfully executed a complete System on Chip (SoC) design, including simulation and tape-out for its latest-generation vehicle integration processor. This achievement was made possible by AWS’s advanced global infrastructure in high-performance computing and artificial intelligence and machine learning services.
Adhir Mattu, CIO and Senior Vice President of NXP Semiconductors, remarked, “Leveraging AWS’s cloud services portfolio has been key to accelerating our semiconductor innovation development and production cycles. Our engineers can dynamically provision the computing capacity they need, when they need it, to power our most demanding EDA workloads. This has driven productivity and time to market for our cutting-edge products.”
The Future of Semiconductor Innovation
NXP’s decision to migrate its design processes to the cloud represents a growing trend in the semiconductor industry. Nafea Bshara, Vice President and Distinguished Engineer at AWS, commented, “NXP is a pioneer in leveraging the cloud for designing and manufacturing cutting-edge semiconductors. We are excited to expand our collaboration and help NXP push the boundaries of what is possible using cloud and generative AI technologies to drive even greater efficiency.”
This collaboration between NXP and AWS promises to accelerate innovation in the semiconductor field, which could have a significant impact on various technological sectors in the years to come.