During the “Intel Foundry Direct Connect 2025” event, the company presented its technology roadmap, key ecosystem partnerships, and advancements in advanced packaging.
Intel has taken a significant step to establish itself as one of the leading semiconductor foundries in the world. At the Intel Foundry Direct Connect 2025 event held in San Jose, California, the company unveiled substantial progress in process technologies, advanced packaging, and domestic manufacturing, accompanied by a strengthened strategy for collaboration with customers and ecosystem partners.
Lip-Bu Tan, CEO of Intel, opened the session reaffirming the company’s commitment to its transformation as a system foundry: “Our focus is on earning the trust of our customers by providing solutions that drive their success. We are committed to a strong engineering culture and a network of partners that supports our long-term execution.”
14A and 18A: Key Next-Generation Nodes
One of the most noteworthy announcements was the introduction of the Intel 14A node, the successor to Intel 18A. The company has already distributed preliminary design kits (PDKs) to strategic customers and has received expressions of interest for the development of test chips. This new node will integrate PowerDirect technology, an evolution of the PowerVia back-powering system already present in 18A.
Intel 18A, currently in risk production, is expected to reach volume manufacturing by the end of the year. Concurrently, Intel announced Intel 18A-P, a variant that enhances performance while maintaining compatibility with the original design. Additionally, Intel introduced Intel 18A-PT, an energy-efficient optimized version, ready for integration with hybrid 3D connections through Foveros Direct, with an interconnect pitch of less than 5 µm.
It was also confirmed that the first production at 16 nm is already underway, and collaboration with UMC is in place for a future 12 nm node and its derivatives.
New Options in Advanced Packaging
Intel continues to invest in integrating complete systems on chip through cutting-edge packaging technologies. Innovations include Foveros-R and Foveros-B, new variants of the Foveros architecture enabling more efficient and flexible designs, as well as EMIB-T, designed to meet the growing bandwidth needs in advanced memories.
In collaboration with Amkor Technology, Intel will offer more options for its customers to choose the packaging technology that best suits their needs.
Advancements in Domestic Manufacturing
The Fab 52 facility in Arizona has processed its first batch of wafers, marking the start of domestic production of Intel 18A nodes. Large-scale production will begin at the Oregon facilities, while research and development activities for Intel 14A will also be centered in the U.S., reinforcing the company’s commitment to a resilient and local supply chain.
Strengthened Ecosystem: Strategic Alliances and Programs
During the event, Intel enhanced its collaboration network with key partners such as Synopsys, Cadence, Siemens EDA, and PDF Solutions. New initiatives within the Intel Foundry Accelerator Alliance were also highlighted, including the Chiplet Alliance and the Value Chain Alliance, focused on enabling interoperable and secure infrastructures for governmental applications and critical commercial markets.
These alliances span from intellectual property (IP) and electronic design automation (EDA) to cloud services and design, forming a comprehensive platform for joint innovation.
An Ambitious Strategy in a Challenging Context
Intel makes it clear that its goal is not just to compete but to lead. However, the company acknowledges the multiple risks and uncertainties in the sector: from geopolitical volatility and trade tensions between the U.S. and China to technological and talent challenges in developing next-generation processes.
Despite this, Intel’s vision is clear: to build a world-class foundry that not only competes with rivals like TSMC and Samsung but also provides a solid and sovereign alternative for the future of advanced computing.
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Source: Intel Press Release