Intel is strengthening its commitment to technological innovation through collaboration with key ecosystem partners to optimize chip manufacturing in the era of artificial intelligence.
Intel has announced a significant advancement in its foundry ecosystem, focusing on facilitating the optimization, manufacturing, and assembly of system-on-chip (SoC) designs for its customers. In collaboration with ecosystem partners, Intel is providing validated EDA tools, design flows, and intellectual property (IP) portfolios for silicon design to packaging, enabling companies to innovate at all technological levels and meet the growing demands of artificial intelligence.
Innovation in Chip Architecture
With the growing need to extend Moore’s Law, Intel Foundry has developed the Embedded Multi-die Interconnect Bridge (EMIB) technology, an innovative approach that allows cost-effective scaling to larger silicon areas by connecting multiple dies in a single package. EMIB simplifies the design process and offers flexibility, already proven in advanced Intel products such as the Intel® GPU Max series, 4th generation Intel® Xeon® processors, and Intel Stratix® 10 FPGAs.
Collaboration with Key Partners
Intel has worked closely with EDA and IP key partners to ensure that their tools, flows, and methodologies for heterogeneous design, as well as reusable IP blocks, are fully enabled to support customers interested in using EMIB technology. Recent collaboration announcements include:
– Ansys: Collaborating with Intel Foundry to provide thermal and power integrity verification, as well as mechanical reliability of EMIB technology.
– Cadence: Announced the availability of a complete 2.5D EMIB packaging flow, digital and custom/analog flows for Intel 18A, and IP design for Intel 18A.
– Siemens: Introduced the availability of a reference flow for Intel Foundry customers, as well as certification of Solido™ Simulation Suite for custom IC verification on Intel 16, Intel 3, and Intel 18A nodes.
– Synopsys: Announced the availability of its AI-driven multi-die reference flow for Intel’s advanced EMIB packaging technology, accelerating the development of multi-die designs.
A Robust Ecosystem for Innovation
Intel’s role within the global technological ecosystem is more crucial than ever to restore global stability and resilience. This week’s announcements underscore Intel Foundry’s commitment to building a strong ecosystem that already includes fundamental IP, system technology optimization, and essential EDA tools for foundry customers to customize and accelerate their next-generation silicon products.
Towards the Future of Technology
A strong ecosystem of IP and EDA is vital for any foundry business, and Intel Foundry, through collaboration with companies like Synopsys, Siemens, Cadence, and Ansys, is ensuring access to their cutting-edge technologies. This provides non-fabricating customers with a wide range of design tools, flows, and reusable IP, positioning Intel as a leader in the era of artificial intelligence.
Intel continues to demonstrate its commitment to technological innovation and collaboration, paving the way for a new era of advancements in chip manufacturing and integrated system design essential to meet the growing demands of artificial intelligence.