ASML has announced the delivery of its latest high numerical aperture (NA) EUV lithography system to a second customer. Previously, the company had shipped one of these advanced systems to Intel Corporation between December 2023 and January 2024, but the identity of the second customer has not yet been revealed. Possible buyers include contract chip manufacturers such as TSMC and Samsung Electronics, who produce chips for companies like NVIDIA and Apple.
These cutting-edge systems, valued at approximately €3.5 billion (around $3.7 billion USD) each, are meant to support the production of the next generation of smaller and faster chips. Both TSMC and Samsung have declared their plans to adopt this new system, which is expected to significantly increase the number of transistors that can be integrated into a single chip.
Intel plans to begin using the high NA system for early production of its 14A series chips between 2026 and 2027. The first high NA system was assembled at ASML’s headquarters in Veldhoven, the Netherlands, and companies using EUV technology can utilize the system for testing purposes. ASML reports having received orders for 10 to 20 units of this advanced equipment.
Lithography systems use beams of light to create circuits on chips. ASML’s first-generation EUV systems are already widely used for manufacturing most of the chips in smartphones and AI applications. These systems employ “extreme ultraviolet” light to print patterns with line widths as fine as 13nm.
According to sources, the high NA system has achieved printing patterns with line widths of 10nm, with a theoretical resolution limit of 8nm. This capability represents a significant advancement in chip manufacturing technology, enabling the production of more powerful and efficient electronic devices.
The expansion of the use of high NA EUV lithography systems by major semiconductor manufacturers marks a significant milestone in the industry, highlighting ongoing innovation and technological progress in chip manufacturing. This technology will enable companies to meet the growing demand for smaller and faster devices, thereby driving the development of new applications in various areas, from consumer electronics to artificial intelligence and beyond.
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