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A Strategic Agreement for the Next Generation of Semiconductors
ASML and imec have signed a new five-year strategic partnership agreement aimed at accelerating the development of advanced semiconductor technologies and fostering sustainable innovation. The collaboration combines ASML’s expertise as a leader in advanced lithography with imec’s research capabilities in nanoelectronics and digital technologies.
This agreement strengthens the cooperation between both entities and is part of the European strategy to consolidate its technological autonomy in chip manufacturing. Furthermore, it aligns with the goal of the European Union’s Chips Act, which seeks to enhance the continent’s competitiveness in semiconductor production and reduce its dependence on external markets.
Cutting-Edge Technology for the Semiconductor Industry
The partnership includes the use of ASML’s entire product portfolio, including its extreme ultraviolet (EUV) lithography systems with high numerical aperture (0.55 NA and 0.33 NA), deep ultraviolet (DUV) immersion lithography, as well as optical metrology tools YieldStar and HMI’s multiple beam inspection technologies.
These technologies will be installed in imec’s pilot line, a reference center for R&D in sub-2nm semiconductors. This infrastructure will be part of the NanoIC pilot line, a project funded by the EU and Flanders, which will provide the world’s most advanced R&D ecosystem in this field.
The joint research will focus on several key areas:
- Silicon Photonics, enabling the development of faster and more efficient chips.
- Advanced Memory, to improve performance and energy efficiency of electronic devices.
- Advanced Packaging, crucial for chip integration in AI applications.
Sustainable Innovation: A New Pillar of Collaboration
In addition to technological development, this agreement introduces a sustainability component, with ASML committing to fund ideas and activities within imec’s research ecosystem that deliver environmental and social benefits.
In this regard, the collaboration will seek solutions to reduce the environmental impact of semiconductor manufacturing, optimize energy consumption in production processes, and develop more sustainable materials.
A Key Boost for European Technological Sovereignty
ASML’s President and CEO, Christophe Fouquet, highlighted the importance of this agreement:
“This agreement marks the next step in our historic cooperation with imec. It reflects our joint ambition to develop solutions for the semiconductor industry and aligns with our strategy of investing in technology and innovation that benefits society as a whole.”
For his part, imec’s President and CEO, Luc Van den hove, emphasized the relevance of access to the most advanced lithography technology:
“We are excited to continue our partnership with ASML, which has been key to accessing advanced chip manufacturing solutions for over 30 years. The inclusion of ASML’s entire product portfolio will allow us to expand the capabilities of our pilot line and provide the semiconductor industry with the most advanced R&D to tackle technology challenges driven by artificial intelligence.”
Financial Support from the Chips Act and European Governments
The agreement not only includes ASML’s investment but is also part of the Chips Joint Undertaking, with funding from the EU’s Digital Europe and Horizon Europe programs. Additionally, it receives support from the governments of Belgium (Flanders), France, Germany, Finland, Ireland, and Romania.
Furthermore, the development of the 0.55 NA technology at imec has been funded as part of the Next Gen-7A (IPCEI22201) project, considered a Project of Common European Interest (IPCEI) and backed by the Dutch government.
With this new agreement, ASML and imec reinforce their position as key pillars in semiconductor development in Europe, ensuring that the region remains at the forefront of the industry and reducing its dependence on other technological powers.
Source: ASML
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