The world’s largest OSAT standardizes on EPYC and Ryzen CPUs to enhance performance, energy efficiency, and its artificial intelligence strategy
ASE Technology Holdings, the largest semiconductor assembly and test company (OSAT) in the world, has made a decisive commitment to AMD processors to bolster its IT infrastructure and respond to the demands of the era of artificial intelligence and smart factories. The company, which serves major foundries and chip manufacturers globally, has reportedly improved system performance by 50% and reduced energy consumption by 6.5%, according to recent data.
From Supplier to User: A Strategic Leap
Although ASE has collaborated with AMD since 2007 on developing advanced packaging technologies like 2.5D interposers, the transition to integrating AMD hardware into its own infrastructure marks a strategic shift. According to Jekyll Chen, IT infrastructure director at ASE, the decision was made after evaluating several key factors: performance, stability, energy efficiency, scalability, total cost of ownership (TCO), and capabilities for AI workloads.
“Our challenges include handling large volumes of data analysis, running artificial intelligence algorithms, and maintaining the efficiency and flexibility required in our smart factories,” Chen explained.
EPYC and Ryzen Processors: A Future-Oriented Bet
After a proof-of-concept phase with AMD and its OEM partners, ASE began the gradual migration of its workloads—both client and data center—to platforms based on AMD EPYC and Ryzen processors. According to the company, this decision has not only provided substantial improvements in performance and energy efficiency but has also resulted in a 30% savings in total cost of ownership compared to previous solutions.
The new servers enable ASE to run complex tasks in parallel, optimize engineering design performance, and scale its operations as the demands for AI and real-time analytics intensify.
AI and Advanced Packaging: A Technological Convergence
ASE has also begun evaluating the AMD Instinct MI300 Series GPUs, designed to accelerate AI workloads in data centers. This transition is part of a broader vision of technological leadership in heterogeneous packaging and component integration, where high-performance computing becomes an operational necessity.
“Our commitment to AMD aligns with our roadmap to continue leading the advanced packaging sector and ensure that our smart factories have the right computing tools to stay at the forefront,” Chen stated.
Environmental Impact and ESG Commitment
In addition to performance and efficiency, ASE emphasized that its choice of AMD also reflects its commitment to ESG (environmental, social, and governance) policies. The reduction in energy consumption and the lesser use of resources compared to other solutions have contributed to reinforcing its sustainability strategy.
Conclusion
At a time when the benefits of advanced lithographic nodes are becoming increasingly marginal, the combination of high-performance processors and smart packaging solutions makes a real difference. ASE is clear: betting on AMD is investing in a future where efficiency, scalability, and artificial intelligence define business success.
Source: techpowerup