The expansion of artificial intelligence servers is shifting pressure onto another less visible part of the tech infrastructure: printed circuit boards (PCBs) and the materials needed to manufacture them. The Taiwanese industry has experienced price increases throughout 2026, and various sector sources forecast that tensions in CCL laminates, specialized fiberglass, and advanced copper could persist into 2027.
The key reasons for PCB price increases in 30 seconds
- PCB and related material manufacturers have been informing their clients for months about rising raw material costs.
- Some CCL manufacturers have applied increases of 20% to 40% depending on the product.
- The demand for AI servers and ASICs requires more complex PCBs and higher-performance materials.
- Second-generation Low Dk and T-Glass materials are among those with the tightest supply constraints.
- This pressure could continue into 2027, especially for high-performance computing products.
This situation is particularly relevant because an AI accelerator doesn’t rely solely on TSMC’s ability to produce enough GPUs or SK Hynix, Samsung, and Micron’s capacity to supply sufficient HBM memory. Each server must integrate these chips onto boards capable of transmitting huge amounts of data and energy, with requirements increasing as hardware performance grows.
This shift is driving higher consumption of specialized materials and causing certain components, once considered secondary, to become potential bottlenecks.
From copper to fiberglass: Why are PCBs rising in price?
An advanced printed circuit board is the result of an industrial supply chain that is significantly more complex than it appears.
A basic element is the CCL (Copper-Clad Laminate). The various layers and connections of the PCB are built on these laminates.
Their manufacture depends on materials like copper foils, epoxy resins, and fiberglass fabrics. Between layers, prepreg or PP — pre-impregnated resin materials — are used to bond them during manufacturing.
The problem is that nearly all these elements are experiencing pressure simultaneously.
Taiwanese CCL manufacturers began new adjustment rounds in the first half of 2026. For example, Taiwan Union Technology announced increases of up to 20% to 40% in certain product families, while other companies applied near 10% or higher increases depending on the products. Panasonic announced increases of 15% to 30% for various materials related to CCL and prepreg.
Therefore, there isn’t a single rate applicable across the industry. The percentage varies depending on the material, its properties, the manufacturer, and the customer.
| Material | Situation in 2026 | Why it matters |
|---|---|---|
| CCL | Price increases across different ranges | It’s the base material for manufacturing PCBs |
| Prepreg (PP) | Cost hikes tied to raw materials | Bonds the different circuit layers |
| Low Dk | Supply particularly tight in advanced ranges | Reduces signal loss at high speeds |
| T-Glass | Limited supply | Essential for advanced PCBs and substrates |
| HVLP Copper | Capacity under tension | Enhances high-frequency signal transmission |
| ABF Substrates | Growing demand | Used in advanced chip packaging |
The result is a price increase starting from raw materials and traversing much of the manufacturing supply chain.
AI servers demand increasingly advanced circuit boards
AI is a key driver behind much of this pressure, although it isn’t the only factor.
New generations of GPUs and ASIC accelerators require interconnections capable of moving enormous amounts of data between processors, HBM memory, network interfaces, and other components.
Increasing transmission speeds complicates PCB design.
Electrical signals lose quality as they pass through materials, especially at higher frequencies. That’s why manufacturers need laminates with better electrical properties and specialized fibers.
One such fiber is Low Dk, designed to provide a reduced dielectric constant to decrease losses in high-speed communications.
Estimates from Asian media indicate a supply deficit of certain second-generation Low Dk fibers exceeding 60% during the second half of 2026. These are market estimates, not audited production figures, but they show the sector expects persistent tightness in supply.
T-Glass presents another challenge.
This fiber type offers suitable features for high-performance substrates and boards, but expanding production isn’t immediate. Industry analyses suggest restrictions could persist into 2027 despite announced expansion projects by various manufacturers.
The outcome is a familiar scenario in the semiconductor industry: production capacity for the final product can grow faster than some of its specialized materials.
An AI server is raising expectations across the entire supply chain
The evolution of PCBs also helps explain why building AI infrastructure is much more than just acquiring GPUs.
New systems require more layers, larger boards, and materials capable of handling higher transmission speeds.
Industry analyses indicate that traditional server PCBs typically featured around 12-16 layers, while some AI platforms are moving toward 20-30 layers, with future architectures likely requiring even more.
This has secondary effects.
The tougher and more sophisticated the material, the more wear and tear the manufacturing tools endure. Manufacturers must perform thousands of precise perforations to create vertical connections between layers of the PCB.
Pressure, therefore, can extend from the fibers and copper to secondary elements like drill bits used in manufacturing.
Demand for HVLP (Hyper Very Low Profile) copper foils, which have a smoother surface to help reduce signal loss, is also increasing.
DigiTimes reports that supply of certain advanced HVLP copper variants remains tight, and manufacturers have begun passing these increased costs on to customers.
Substrates for GPUs and ASICs are also seeing price hikes
The same trend is affecting substrates used in advanced semiconductor packaging.
AI GPUs and ASICs developed by major cloud providers require integrating massive compute chips with HBM memory and other interfaces into increasingly larger packages.
This drives up the demand for advanced materials.
Particularly relevant are FC-BGA (Flip Chip Ball Grid Array) substrates. Some analyses predict that T-Glass supply constraints could contribute to maintaining tightness through 2027.
So, pressure is mounting from both ends.
TSMC and other manufacturers need to increase advanced packaging capacity. Memory producers need to manufacture more HBM. Substrate providers require more ABF and T-Glass. Likewise, server manufacturers require increasingly complex PCBs.
AI is accelerating all these supply chains simultaneously.
The cost of AI infrastructure also depends on lesser-known materials
Large announced data center investments are often expressed in number of GPUs, electrical megawatts, or billions of euros. However, the actual ability to deploy these systems depends on a much broader supply chain.
In recent years, constraints have appeared sequentially in GPUs, HBM memory, advanced packaging, power transformers, and specific cooling components.
PCBs and their materials are now joining this list.
The key question for the second half of 2026 is how much manufacturers can pass these higher costs onto their customers. Some Taiwanese industry sources anticipate new price rounds as contracts are renewed and companies try to protect margins.
Additionally, increasing advanced material capacity takes time. Even with ongoing investments, new production lines require installation, qualification, and achieving acceptable yields before contributing meaningful volumes.
That’s why 2027 is repeatedly appearing in industry forecasts.
The race to build more AI capacity shows that the bottleneck can shift very quickly. Fixing GPU supply alone isn’t enough if HBM, packaging, PCBs, or even the right fiberglass for manufacturing those boards are missing.
Frequently Asked Questions
Why are PCB prices rising?
The industry is experiencing supply restrictions and cost increases in materials such as CCL, prepreg, specialized fiberglass, resins, and certain copper types. Growing demand from AI servers and high-performance computing further drives up the consumption of the most advanced ranges.
What is CCL used in PCBs?
CCL stands for Copper-Clad Laminate. It is one of the basic materials used to build the conductive layers of a printed circuit board.
How do AI GPUs relate to shortages of T-Glass and Low Dk?
AI servers require high-speed communications and more complex PCBs. This increases demand for materials with better electrical and thermal properties, including certain Low Dk fibers and T-Glass.
Will prices continue rising in 2027?
Some Asian supply chain analyses forecast that certain restrictions, especially those related to advanced materials, could persist into 2027. The evolution will depend on AI demand and how quickly manufacturers can add new capacity.
