Xiaomi has announced the XRING O3, its new generation of in-house mobile processors. The chip is manufactured by TSMC using 3-nanometer technology, features 24 billion transistors, and adopts a ten-core CPU without the traditional efficiency cores. One of its most noteworthy innovations is in memory: Xiaomi claims it is the first smartphone SoC compatible with LPDDR6, offering up to 113.8 GB/s bandwidth.
The key features of Xiaomi XRING O3 in 20 seconds
- Xiaomi maintains the 3 nm process for its new processor, with 24 billion transistors in 133 mm².
- Its CPU uses ten high-performance cores and reaches up to 4.35 GHz.
- It debuts a 16-core G2-Ultra NX GPU.
- It is the first mobile processor announced with LPDDR6 at 10,667 Mbps, according to Xiaomi.
- It will debut in September in the Xiaomi 18 Fold.
The XRING O3 replaces the XRING O1, launched in 2025, confirming Xiaomi’s intention to continue investing in proprietary silicon. The company thus joins a select group of smartphone manufacturers capable of internally designing some of the processors used in their devices, even though they still rely on external foundries for manufacturing.
This decision has an industrial significance as well. Developing an in-house SoC allows Xiaomi to better control aspects such as CPU, graphics, AI, image processing, memory, and power consumption. It also reduces its technological dependence on external suppliers like Qualcomm and MediaTek.
A ten-core CPU without small efficiency cores
Xiaomi has opted for an unconventional configuration for the XRING O3.
The CPU includes ten cores divided into three clusters: two Arm C1-Ultra cores up to 4.35 GHz, four C1-Premium cores at 3.68 GHz, and four C1-Pro cores at 3.15 GHz. None correspond to the traditional small cores mainly used for low-power tasks.
The processor also features 16 MB of system level cache (SLC).
Xiaomi attributes approximately a 60% increase in CPU performance compared to the XRING O1 to this architecture. The company also claims up to a 25% improvement in energy efficiency under certain low- to medium-load conditions. These figures are provided by the manufacturer and will need validation through independent testing once commercial devices are available.
Physically, the change has resulted in the XRING O3 occupying roughly 133 mm², compared to 109 mm² of its predecessor, with 24 billion transistors.
Xiaomi has not yet adopted the 2 nm process. The company continues to use TSMC’s 3 nm, specifically identified by various sources as N3P.
Another significant change appears in graphics. The XRING O3 incorporates a 16-core Arm G2-Ultra NX GPU. Xiaomi claims it offers up to an 85% increase in graphics performance and a 182% improvement in ray tracing over its previous generation, while also reducing energy consumption under certain conditions. Again, these are internal comparisons and not yet validated by independent benchmarks.
LPDDR6 bandwidth reaches up to 113.8 GB/s
Memory could become one of the most technically interesting features of the XRING O3.
The processor supports LPDDR6 at 10,667 Mbps via a 4 × 24-bit bus, achieving a maximum bandwidth of 113.8 GB/s. Xiaomi estimates a 48% improvement over the XRING O1.
This isn’t just about increasing a figure on the spec sheet. Memory bandwidth is gaining increasing importance in mobile devices due to rising graphics loads and especially for locally running AI models.
LPDDR6 is the new low-power memory generation intended for smartphones and other devices. JEDEC published the JESD209-6 standard in July 2025, with an initial speed of 10.667 Gbps and potential to reach 14.4 Gbps. The standard also includes modifications from LPDDR5X to enhance performance and efficiency.
Timely adoption of this generation could give Xiaomi an initial advantage, though actual availability and costs of LPDDR6 will be critical factors when volume sales begin.
The XRING O3 also features a NPU (Neural Processing Unit) designed for on-device AI inference. Its advertised tensor computing capacity is 200 TOPS, with 3.13 TFLOPS of vector processing. Xiaomi claims a 45% improvement in AI workloads compared to the previous generation.
Xiaomi also upgrades photography and video capabilities
In-house design allows Xiaomi to influence another increasingly important aspect of smartphones: image processing.
The XRING O3 includes the fifth generation of the company’s ISP (Image Signal Processor) and supports sensors up to 432 megapixels, along with multi-camera configurations.
It also supports 24-bit color processing and hardware acceleration for different video workloads, including decoding H.266/VVC.
This integration makes the XRING O3 more than just a performance-focused update. Xiaomi is integrating CPU, GPU, NPU, memory, and image processing tailored specifically for its own devices.
The first opportunity to evaluate the results will be soon.
Xiaomi has confirmed that the XRING O3 will debut in September in the Xiaomi 18 Fold, its upcoming foldable smartphone. Some sources also suggest it will appear in the upcoming Xiaomi Pad 9 Pro Max.
Initial indications point to the Chinese market. Therefore, it remains unconfirmed whether devices with XRING O3 will be available internationally at launch.
Beyond these initial products, this move signifies Xiaomi’s strategic aim to develop more advanced processors. Designing high-end chips requires sustained investments and substantial engineering teams, and Xiaomi seems committed to expanding this capability across more product categories.
Alongside the XRING O3, other proprietary silicon developments have been announced, including the XRING O100 focused on AI, and the XRING D100 related to automotive applications. The goal is for the XRING family to extend beyond smartphones.
Nonetheless, the XRING O3 remains the most immediate test. Its ambitious specifications—especially the jump to LPDDR6, the new CPU configuration, and the 16-core GPU—will be validated through the tests on the Xiaomi 18 Fold, which will show how much of these improvements translate into real-world sustained performance, battery life, and thermal behavior in commercial devices.
FAQs
What manufacturing process is used for the Xiaomi XRING O3?
The XRING O3 is manufactured by TSMC using 3 nanometers technology. Technical details specifically identify the node as N3P.
Is the XRING O3 compatible with LPDDR6 memory?
Yes. Xiaomi claims it is the first smartphone processor announced with LPDDR6, supporting speeds up to 10,667 Mbps and bandwidth of 113.8 GB/s.
How many cores does the XRING O3 have?
Its CPU has ten cores: two C1-Ultra cores up to 4.35 GHz, four C1-Premium cores at 3.68 GHz, and four C1-Pro cores at 3.15 GHz. Xiaomi skips the traditional small efficiency cores.
Which mobile device will first feature the XRING O3?
The first device announced with the new processor will be the Xiaomi 18 Fold, scheduled for release in September 2026.
