TSMC is entering that phase of the tech cycle where a manufacturing node stops being “the next in the road map” and becomes the industry’s real funnel. According to information published by Wccftech, the 2 nm (N2) process is registering 1.5 times more tape-outs than the 3 nm node in a comparable period, with Apple, Qualcomm, and MediaTek being significant players in the initial push.
It’s worth highlighting two things from the start: (1) “tape-out” is not mass production; it’s the milestone where a design is “locked” and sent to the foundry to produce the first chips. And (2) much of the noise around N2 blends analyst data, leaks, and forecasts, so it’s smart to read it as a demand thermometer, not a signed contract.
Nevertheless, the pattern is hard to ignore: more companies are betting early on the jump to 2 nm because, amid the AI boom, competitive advantage is no longer just about “a bit more performance,” but about energy efficiency, density, and capacity availability.
Why does more “tape-outs” matter?
The number of tape-outs typically correlates with something specific: how many product teams dare to move a design (very expensive and critical) to the new node. An increase in volume means:
- More customers testing or planning chips in N2.
- More product families (mobile, PC, accelerators, networking, automotive) pushing simultaneously.
- More pressure on manufacturing capacity and advanced packaging (essential in AI).
Wccftech adds, citing leaker @jukan05 and a note attributed to Morgan Stanley, that the appetite for N2 could be so high that TSMC’s share in AI accelerators might reach huge figures, with very aggressive capacity ramp-up. That, today, should be treated as speculation, but it fits the market dynamics: when electricity costs and computing density matter, every percentage point of efficiency counts.
N2 and N2P: the technological leap (and why it’s not just “one nm less”)
TSMC N2 introduces the transition to GAA (gate-all-around) nanosheet transistors, a new architecture that the industry has been preparing for years. Simply put: the transistor is better controlled, leaks are reduced, efficiency improves, and there’s room to continue scaling.
Furthermore, TSMC’s ecosystem supports “refined” variants. One of the most discussed is N2P, an evolution of N2 expected to offer incremental improvements. Looking further ahead, TSMC explained that A16 (1.6 nm class) is related to N2P technology and incorporates backside power delivery, designed to improve performance and efficiency in demanding scenarios.
In other words: it’s not just a node; it’s a family with steps, which makes many companies plan products along a “road” (N2 → N2P → A16) depending on their needs: cost, performance, power consumption, or time-to-market.
Schedule: when is it really “going to be real”?
The biggest bottleneck of any new node isn’t the announcement; it’s the manufacturing yield and capacity. For N2, specialized media suggest production start windows around late 2025, with ramp-up during 2026, aligning with the idea that “the big game” for N2 will happen in 2026.
That’s why it’s so relevant that tape-outs are increasing now: those who get to a new node first are not only aiming for better chips but also securing a spot on a calendar where everyone is competing for the same thing.
Apple, Qualcomm, and MediaTek: why everyone’s aiming at the same target
The piece from Wccftech points to Apple as a major customer that could absorb a large part of the initial capacity, with Qualcomm and MediaTek trying to keep pace. These names are logical given their volume and sensitivity to energy efficiency, though many of these assignments are rumors until official confirmation or announced products.
More tangible signals include “preparatory work.” For example, it’s been reported that MediaTek planned to complete a tape-out of 2 nm with TSMC around September 2025, as part of its roadmap, illustrating that N2 designs are not just abstract ideas—they’ve been in development for months or years.
The AI factor: why memory, packaging, and energy matter so much
In 2026, raw performance matters, yes, but the key decision criterion is the total cost of ownership:
- Efficiency per watt: in data centers, power and cooling costs weigh as much as the chip itself.
- Density: more compute per rack and per square meter.
- Advanced packaging: many accelerators rely on complex (and costly) integration to scale.
When a company decides to move a design to the cutting-edge node, it’s buying an option: either I gain efficiency/performance and differentiate myself, or at least don’t fall behind.
What to watch for going forward
If the “1.5 times more tape-outs” figure consolidates across sources, the focus won’t be on the headline but on its implications:
- Reserved capacity: who gets the early lots and in what volumes.
- Yield and costs: whether the node matures quickly or the curve extends.
- Price domino effect: when the leading node fills up, “earlier” nodes (3 nm, 4/5 nm) will also face pressure.
- Competition: any delays or unexpected jumps in other foundries can shift investments, but TSMC currently has an advantage due to its history and ecosystem.
Frequently Asked Questions
What exactly does “tape-out” mean for 2 nm chips?
It’s the step where the final design is sent to the foundry to produce the first wafers. It doesn’t involve mass production but indicates the chip is sufficiently finalized to begin real validation.
When will commercial products fabricated on TSMC N2 (2 nm) arrive?
The market expects initial production of N2 around late 2025, with broader deployment during 2026, according to industry reports.
Is N2P the same as N2?
No. N2P is typically described as an enhancement/optimization of N2, with tweaks to maximize performance or efficiency. Technologies like A16 build on that line and incorporate changes such as backside power delivery.
Why is AI accelerating the move to 2 nm so much?
Because AI makes energy efficiency and density direct competitive advantages: fewer watts per inference/training, more performance per rack, and better operational margins.