The world’s leading manufacturer of memory chips advances its advanced packaging strategy with a new facility in South Korea
SK hynix, one of the global giants in memory chip manufacturing, has begun preparations to build a new back-end production facility in Cheongju, located in North Chungcheong Province. The facility, provisionally named “P&T 7,” will enhance the company’s packaging capabilities amid growing demand for advanced chips.
According to industry sources cited on Tuesday, SK hynix has internally announced its decision to establish the new plant on the site of a previously acquired LG factory. The company is currently conducting demolition work on the existing building, aiming to complete this phase by September.
“The role of back-end processes in memory semiconductors is becoming increasingly relevant, as they provide significant added value beyond traditional manufacturing,” a spokesperson for SK hynix stated. “Our goal is to enhance packaging technology.”
Seventh P&T plant in South Korea
With this new facility, the company will add its seventh back-end plant in South Korea. The current six are located in Icheon and Cheongju, reflecting the strategic significance of these regions in SK hynix’s production chain.
Although the construction timeline for the P&T 7 plant has yet to be defined, the site is expected to serve a dual purpose: in addition to being a packaging plant for final products, it will also function as a testing facility.
Advanced packaging: the new frontier of chip innovation
The back-end process in semiconductor manufacturing encompasses the final phases, where individual chips are separated from the wafer, tested, and encapsulated to become products ready for integration into electronic devices.
As traditional semiconductor scaling approaches physical limits, the industry is shifting toward more sophisticated packaging technologies as a means to improve chip performance and energy efficiency. In this context, manufacturers like SK hynix are doubling down on innovations in 3D packaging, high-density interconnections, and solutions that enable multiple chips to be integrated into a single module.
The decision to expand its infrastructure in this area underscores SK hynix’s commitment to technological leadership and its readiness to meet the demands of new applications in artificial intelligence, data centers, and advanced mobile devices.
via: koreaherald