Element Six (E6), a leader in advanced synthetic diamond solutions, has unveiled its revolutionary diamond-copper composite material, called Cu-Diamond, at the Photonics West 2025 event. Designed to address the growing challenges of thermal management in advanced semiconductor devices, the material promises to enhance performance in applications such as Artificial Intelligence (AI), high-performance computing (HPC), and gallium nitride (GaN) radio frequency devices.
Exceptional Properties for Thermal Management
The Cu-Diamond features outstanding thermal conductivity that reaches 1000 W/mK in certain configurations, positioning it far above traditional materials like pure copper. Additionally, the material offers an adjustable thermal expansion coefficient, facilitating its integration into advanced semiconductor packaging designs. This translates into superior heat dissipation capabilities, preventing thermal bottlenecks and enhancing the reliability and lifespan of electronic devices.
Key benefits include:
- Significant reduction of thermal issues in high-power devices.
- Improved thermal performance in device packages.
- Increased reliability and durability in repetitive thermal cycles.
- Capability to support customized configurations based on customer needs.
Innovation for a New Generation of Devices
The Cu-Diamond not only offers high performance, but its scalable and cost-effective manufacturing makes it accessible for a wide range of applications. From cooling systems for data centers to potential use in high-end CPU and GPU heatsinks, this material promises to transform the thermal management landscape.
“Thermal management remains one of the biggest challenges for semiconductor devices, especially in an environment of increasing power density and packaging complexity. With Cu-Diamond, we provide a solution that not only improves performance but also reduces cooling costs and facilitates integration into next-generation technologies,” stated Daniel Twitchen, Chief Technology Officer of Element Six.
Versatility and Adaptability
The Cu-Diamond can be supplied in sizes ranging from a few millimeters to several centimeters. It is also available with thin metallic coatings, such as gold (Au) and nickel (Ni), which enable compatibility with standard component bonding techniques. Additionally, the material can be produced in complex shapes, such as sheets with holes, steps, or curves, adapting to specific customer needs.
Sustainability and Global Commitment
As part of the De Beers Group, Element Six emphasizes its commitment to sustainability and the United Nations’ Sustainable Development Goals. Its ISO 50001 certified facilities in Germany and Ireland reinforce the integration of responsible practices in the production of advanced technological solutions.
Toward the Future of Thermal Management
The launch of Cu-Diamond marks a significant advancement in material technology for thermal management. Its ability to withstand the most critical challenges in semiconductor design could define the future of high-performance computing and other key industries.
Element Six will demonstrate the capabilities of this innovative material at its booth during Photonics West 2025, where live demonstrations and technical consulting sessions will also take place.
via: Element Six