The leading semiconductor company will unveil innovations in advanced memory, positioning itself as a key player in the global artificial intelligence infrastructure.
SK hynix Inc. has announced that it will showcase its most innovative technologies in the field of artificial intelligence (AI) memory at CES 2025, taking place in Las Vegas from January 7 to 10. Under the slogan “Innovative AI, Sustainable Tomorrow”, the company will present a wide portfolio of products designed to lead in the AI era, from HBM memory to next-generation technologies such as PIM (Processing in Memory).
Leading AI infrastructure with advanced memory
SK hynix, recognized as the first to produce 12-layer HBM memory for AI infrastructure, will showcase highlighted products at the event such as:
- 16-layer HBM3E: Developed with advanced MR-MUF process, this memory offers the most advanced configuration on the market, maximizing heat dissipation and reducing chip deformation.
- High-Performance SSDSolid State Drive or SSD (English acronym for Solid… with high capacity: Includes the D5-P5336 model with 122 TB, developed by its subsidiary Solidigm, optimized for AI data centers.
- QLC NAND Flash: Memory of up to 61 TB, with high storage efficiency, ideal for customers needing extreme capacities in enterprise devices.
Solutions for next-generation devices and servers
In addition to data center products, SK hynix will present technologies that integrate AI into personal devices, including:
- LPCAMM2: A memory module based on LPDDR5X that replaces two DDR5 SODIMMs, providing greater energy efficiency and space savings.
- ZUFS 4.0: Optimized data storage for mobile and electronic devices that improves data transfer and management.
- CMM-Ax: CXL memory modules that add computational functionality and enhance energy efficiency in next-generation server platforms.
Preparing for the future with sixth-generation HBM
SK hynix plans to produce HBM4HBM4 is the next evolution in memory technology,… in the second half of 2025, a breakthrough that will strengthen its position as a leader in the custom HBM memory market. According to CEO Kwak No-jung:
“The changes brought about by artificial intelligence will accelerate this year, and we will continue to present new possibilities through technological innovation to provide irreplaceable value to our customers.”
Collaboration within the SK Group
The SK hynix booth will be part of a joint exhibition with other SK Group subsidiaries, including SK Telecom, SKC, and SK Enmove. This collaboration will highlight how the group’s infrastructures and services are transforming the world through technological innovation.
About SK hynix
Headquartered in South Korea, SK hynix Inc. is one of the world’s leading semiconductor suppliers, offering DRAM memory chips, NAND Flash, and CMOS image sensors (CIS) to customers worldwide.